PCB Design in power electronics is either make-it or break-it.  With continued efforts to reduce cost with die shrinking resulting in higher power densities power nets are physically closer than every before to sensitive control circuits making it easier to break-it in PCB Design.

 

For most power electronic circuits to work  optimally  as possible requires much attention to layout practices such as a few named here.

 

Reduce circulating ground loops by separating power and signal grounds and if must be connected to use a star ground archetecture.

 

Minimize parasitic coupling between power circuits and control circuits which minimizes capacitive and induction coupling.

​

Thermal management is another key dimension as pulling the heat away from power circuits is more and more involved as the power densities increase.  Whether active cooling with a fan or circulating coolant or even submersion of circuitry in coolant liquid.  Even the simple use of a trace or plane to act as a heatsink requires care that adequate temperature margins are met to achieve the desired MTBF targets.

​

There are more details to ensure successful PCB Layout that are covered in follow on consultation support.

​

​